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| SPEC NO : SPECIFICATION CUSTOMER PRODUCT MODEL NO PREPARED APPROVED SAW FILTER HDBF19900B25 CHECKED D A T E CUSTOMER RECEIVED: CHECKED APPROVED DATE Shoulder Electronics Limited www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 1 of 6 SAW FILTER HDBF19900B25 History Record Date Spec No Part No Customer No Modify Content Remark www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 2 of 6 SAW FILTER HDBF19900B25 1. SCOPE This specification shall cover the characteristics of SAW filter with the page system. HDBF19900B25 used for 2. ELECTRICAL SPECIFICATION Maximum incident power in passband Max.DC voltage between any 2 terminals Storage temperature range Operation temperature range Suitable for lead-free soldering-Max.soldering profile +18dBm 30VDC -40 to +85 -10 to +85 260 for 30s Electronic Characteristics Parameter Center Frequency Insertion Loss 1dB Bandwidth Amplitude Ripple over f0100KHz f0-800 to f0-600KHz and f0+600 to f0+800KHz 119MHz to f0-800KHz f0+800KHz to278MHz Group Delay Variation overf0100KHz Frequency Temperature coefficient Minimum 100 35 45 40 Typical 199.0 5.5 140 300 0.32 Maximum 7.0 1.0 500 Unit MHz dB KHz dB dB dB dB nsec ppm/C www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 3 of 6 SAW FILTER HDBF19900B25 3. TEST CIRCUIT www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 4 of 6 SAW FILTER HDBF19900B25 4.DIMENSION Dimension A B C D E H P min 18.8 6.3 1.58 2.15 0.72 mm typ 19.0 6.5 1.76 2.3 1.02 0.76 1.905 max 19.2 6.7 1.94 2.45 0.80 Pin Configuration 10 Input 5 Output Other Ground www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 5 of 6 SAW FILTER HDBF19900B25 5. ENVIRONMENTAL CHARACTERISTICS 5-1 Temperature cycling Subject the device to a low temperature of -40for 30 minutes. Following by a high temperature of +25 for 5 Minutes and a higher temperature of +85 for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in table 1. 5-2 Resistance to solder heat Submerge the device terminals into the solder bath at 260 5 for 101 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in table 1. 5-3 Solderability Submerge the device terminals into the solder bath at 245 5 for 5s, More than 95% area of the soldering pad must be covered with new solder. It shall meet the specifications in table 1. 5-4 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the filter shall fulfill the specifications in table 1. 5-5 Vibration Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1. 6. REMARK 6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component. www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 6 of 6 |
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